TDC Corporation

TDC is an established specialist manufacturer with 67 employees and production facilities in Japan, supported by sales and distribution relationships across international markets. The company reports experience serving more than 3,000 customers, including research organizations, universities, and industrial companies. Its international expansion includes a European sales presence established in Germany as well as distribution partnerships in the United States, Taiwan, and Shanghai. The company has also invested in dedicated production and R&D facilities, including its UP-Factory and a new production facility completed in 2024.

TDC provides ultra-precision manufacturing for components and materials where conventional machining and finishing processes cannot meet the required specifications. Its services cover cutting, grinding, lapping, polishing, CMP, wafer thinning, wafer bonding, cleaning, and precision inspection, with processing available from individual prototypes and research samples through small-lot and mass production.

The company works with a broad range of materials, including metals, ceramics, crystalline materials, semiconductors, glass, and engineering plastics. TDC can process flat, curved, spherical, cylindrical, and complex geometries, while combining several precision parameters within the same component rather than optimizing surface roughness alone.

TDC serves technology and manufacturing sectors where extremely precise surfaces and geometries are required for device performance, measurement accuracy, assembly, or manufacturing reliability. Its applications include semiconductor manufacturing equipment, crystal and semiconductor wafers, optical components, MEMS and NEMS, precision measurement equipment, electronic components, automotive R&D, medical devices, aerospace, and energy technologies.

The company is particularly active in applications involving difficult-to-machine materials and components with demanding geometric specifications. Its processing capabilities are used for semiconductor equipment parts, nanoimprint molds, optical elements, wafer-related components, precision shims, test pieces, reference surfaces, and other components where conventional finishing methods may not provide sufficient precision.

TDC's core technologies include ultra-precision lapping and polishing, precision grinding and machining, CMP, wafer thinning and bonding, surface finishing, and high-accuracy metrology. Its processes are designed to control multiple characteristics simultaneously, including surface roughness, flatness, parallelism, dimensional tolerance, angular accuracy, roundness, and sphericity.

The company works with materials ranging from metals and ceramics to silicon, SiC, sapphire, diamond, quartz, and other advanced crystalline materials. Its combination of precision processing, materials expertise, and metrology enables the production of components with extremely demanding surface and geometric requirements for advanced industrial and research applications.

TDC's precision manufacturing technologies support the development and production of components used in advanced semiconductor, optical, electronic, medical, aerospace, automotive, and energy technologies. In semiconductor manufacturing, its polishing and machining capabilities are used for equipment components such as wafer chuck plates and precision stages, while its wafer processing expertise covers materials including silicon, SiC, sapphire, diamond, and other crystalline substrates.

Its technologies also enable applications outside semiconductor manufacturing. TDC produces highly precise molds for nanoimprint processes, precision surfaces and components for measurement equipment, optical and aerospace components, test pieces for automotive R&D, and precision parts for medical and electronic applications. Its ability to process advanced materials and complex geometries at extremely high levels of precision allows manufacturers and research teams to develop components where surface and dimensional accuracy directly affect system performance.

TDC Fine Polish partners with Metheion to source specialized engineering and technical talent across precision manufacturing, ultra-precision machining, polishing and lapping, materials engineering, metrology, semiconductor manufacturing equipment, optics, and advanced materials.

Metheion specializes in identifying engineers and technical specialists with hands-on expertise in advanced manufacturing and deep-tech applications. Through this partnership, Metheion supports TDC in accessing specialized talent capable of working on precision process development, manufacturing engineering, materials and surface engineering, metrology, equipment development, and the application of ultra-precision manufacturing technologies across demanding industrial and R&D environments.